Immersion Cooling Solution

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immersion cooling solution a

Liquid cooling has been a recognized approach to conditioning electronics for over half a century. Immersion Cooling, which lies at the core of Immersed Computing, involves fully submerging electronic components in a dielectric liquid. This allows all the heat generated by the IT equipment to be trapped within the liquid. Electric liquids with suitable properties can absorb approximately 1500 times more heat energy than air at the same volumes and temperatures.

In terms of device temperature control, the adoption of immersed computing design is becoming a trend. However, the performance of fiber lenses deteriorates in liquids, making it impossible for the I/O link to support the deployment of transceivers and active optical cables. To address this issue, a white-box designed extender cable is developed to be used in immersion solutions. This cable extends optical interfaces into the air, aiming to achieve the interconnection of transceivers and active optical cables.

Features

QSFP28 MSA and SFF-8665 Compliant
Low EMI radiation
Insertion Loss -4.5dB at 100G Application
Oil-resistance, dust-proof and anti-corrosion
100 ohm differential impedance system
Low Near-End Crosstalk (NEXT)
Customization EEPROM mapping for cable signature
RoHS compliant

Applications

Extend the high speed interconnection for liquid immersion solution
Extend the link of AOCs
Extend the link of transceivers

Ordering Information

P/N	Description	Lengths
WB-S/S	10 Gb/s SFP+ to SFP+ Cage, with 3M Flat Cable in Nylon Jacket	10cm/20cm/30cm/55cm/75cm
WB-ZSP/ZSP	25 Gb/s SFP28 to SFP28 cage, with 3M flat cable in nylon jacket	10cm/20cm/30cm/50cm
WB-Q/Q	40 Gb/s QSFP+ to QSFP+ Cage with 3M Flat Cable in Nylon Jacket	10cm/30cm/65cm
WB-ZQP/ZQP	100 Gb/s QSFP28 to QSFP28 cage, with 3M flat cable in Nylon Jacket	10cm/20cm/30cm/50cm
WB-QDD/QDD	200 Gb/s - 400 Gb/s QSFP-DD to QSFP-DD cage, with 3M flat cable in nylon jacket	10cm/20cm/30cm
WB-Q56/4ZQP	400 Gb/s QSFP56 to 4x QSFP28 cage, with 3M flat cable in nylon jacket	10cm/20cm/30cm
For more available options, please contact for detailed information.

For pricing and more detailed information, please contact sales@pcie.com.

immersion cooling solution b

In a data server, all IT component’s energy is converted to heat. It has been proved that heat is counterproductive for all type of IT equipment and can alter its performance and lifespan. To surmount this issue, data centers are constantly cooled to must be kept at a stable temperature. In general, the cooling is done by cooling energy-consuming units such as fans, which have a negative impact on the environment in the long run.

Immersion cooling system basically consists in completely submerging a server into a dielectric liquid. This type of liquid does not conduct electricity; therefore, it is totally safe for the electronics components to be emerged without any risk of shortcuts and oxidation.

This way, all waste heat generated by the components is captured by the dielectric liquid inside the tank, which is capable of absorbing around 1500 times more heat than air, for the same volume. The heat then flows to a heat exchanger where it’s cooled by a secondary air to liquid or liquid to liquid heat exchanger to be dissipated or reused.

This immersion cooling solution with cable planks, when combined with a immersed chassis, can perfectly solve the problem of coolant sealing and extend the interface of the device to the outside.

immersion cooling solution c

Liquid Cooling is changing the way you cool your data center, by eliminating the need for traditional air-cooling infrastructure.

A small amount of dielectric coolant is precisely targeted to remove heat from the hottest components of the server, ensuring maximum efficiency and reliability. This eliminates the need for traditional air-cooling systems and allows for greater flexibility in designing IT solutions. There are no hotspots that can slow down performance, no wasted physical space on unnecessary cooling infrastructure, and minimal need for water consumption.

Immersion rack enclosures requires attention to material and fluid handling specifications to ensure safe and reliable operation. High speed or high-performance network cabling based on copper can normally be used within the chassis. White Box designs this integrated extension box, using port extenders to allow optical connectivity outside of the fluid environment. The box is designed to be mounted to server/switch’s front panel, that makes easier for installation and maintenance.

This design is a customized project. The sizes should be configured according to the customer's equipment and application environment.

Immersion Cooling Solution D

This is a high-speed liquid cooling heat transfer device design. The front ports are cage for QSFP/SFP, and the rear end are the high-speed extension cables. The top face of the cages is a liquid cooling plate.

When the extension cable is inserted into devices such as servers, switches, and storage devices, heat will be transferred to the cages. At this point, the liquid cooling plate on the top has coolant circulating in and out. The coolant can quickly remove heat, allowing the product to operate at high speed and and performance within a controllable temperature range, meeting the needs of customers in various scenarios.

This design can be directly installed on a 1U rack, making it convenient for customers to connect to terminal switches or servers. Meanwhile, the coolant can enter/exit from both sides/front/back/top or staggered surfaces, quickly removing heat and meeting the high-speed operation requirements of the product. If you have design requirement, please contact us for details.

Design Service

With extensive experience, White Box specializes in various PCB designs and system customization services. Our areas of expertise include:

PCB design based on TI, ADI and E2V by controlling time domain specifications: pre-design, clock, simulation optimization, channel insertion loss optimization, channel consistency, phase amplitude consistency and isolation improvement.

High performance PCB design via ADI transceivers AD9361, ADRV9009, ADRV9026, Altera and Xilinx RFsoc series solutions.

High-speed host boards and devices design based on Xilinx 7 series boards, including VPX, CPCI, PCIE and other types of boards.

RF circuit: improving signal sensitivity, increasing signal power, channel signal quality control, improving self-excitation/isolation, and optimizing noise etc.

Customize high-speed backplanes and fixtures, including DDR/USB/PCIe/IC test boards.

Processing of various high-speed high-frequency boards and evaluation boards, PCB impedance and consistency control, with an accuracy of 50/100 ohms up to 5%, meeting the stringent requirements of RF high-speed products.