This is a high-speed liquid cooling heat transfer device design. The front ports are cage for QSFP/SFP, and the rear end are the high-speed extension cables. The top face of the cages is a liquid cooling plate.

When the extension cable is inserted into devices such as servers, switches, and storage devices, heat will be transferred to the cages. At this point, the liquid cooling plate on the top has coolant circulating in and out. The coolant can quickly remove heat, allowing the product to operate at high speed and and performance within a controllable temperature range, meeting the needs of customers in various scenarios.

This design can be directly installed on a 1U rack, making it convenient for customers to connect to terminal switches or servers. Meanwhile, the coolant can enter/exit from both sides/front/back/top or staggered surfaces, quickly removing heat and meeting the high-speed operation requirements of the product. If you have design requirement, please contact us for details.